Publication

Thermal behaviour of miniaturized surface mounted devices

Thomas Sidler
1999
Conference Papers

Abstract

Considerable efforts are presently being made to improve miniaturization of optical devices and to achieve at the same time submicron assembly precision. Several groups are working on concepts based on passive alignment techniques (ex. integrated waveguide structures Si-bench technology) or on the more flexible automated surface mounting techniques based on in-situ alignment procedures during assembly. A detailed knowledge on the thermal behaviour of the miniaturized components becomes inevitable for achieving the desired assembly precision and stability during operation. Here, we report on the thermal behaviour and heat dissipation characteristics of the standardized optical mounts used in the three dimensional miniaturized optical surface mounted device (TRIMO-SMD) technology

Official source

https://infoscience.epfl.ch/entities/publication/030a7f4f-a455-4c1c-a9ba-e102c940125d

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Thomas Sidler
1999
Conference Papers

Abstract

Official source

https://infoscience.epfl.ch/entities/publication/030a7f4f-a455-4c1c-a9ba-e102c940125d

About this result

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Thermal behaviour of miniaturized surface mounted devices

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