Atomic layer depositionAtomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.
Doping (semiconductor)In semiconductor production, doping is the intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million atoms, the doping is said to be low or light.
Ultra high frequencyUltra high frequency (UHF) is the ITU designation for radio frequencies in the range between 300 megahertz (MHz) and 3 gigahertz (GHz), also known as the decimetre band as the wavelengths range from one meter to one tenth of a meter (one decimeter). Radio waves with frequencies above the UHF band fall into the super-high frequency (SHF) or microwave frequency range. Lower frequency signals fall into the VHF (very high frequency) or lower bands.
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
Super high frequencySuper high frequency (SHF) is the ITU designation for radio frequencies (RF) in the range between 3 and 30 gigahertz (GHz). This band of frequencies is also known as the centimetre band or centimetre wave as the wavelengths range from one to ten centimetres. These frequencies fall within the microwave band, so radio waves with these frequencies are called microwaves. The small wavelength of microwaves allows them to be directed in narrow beams by aperture antennas such as parabolic dishes and horn antennas, so they are used for point-to-point communication and data links and for radar.
Plasma cuttingPlasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops, automotive repair and restoration, industrial construction, and salvage and scrapping operations.
Plasma actuatorPlasma actuators are a type of actuator currently being developed for aerodynamic flow control. Plasma actuators impart force in a similar way to ionocraft. Plasma flows control has drawn considerable attention and been used in boundary layer acceleration, airfoil separation control, forebody separation control, turbine blade separation control, axial compressor stability extension, heat transfer and high-speed jet control.
Passive housePassive house (Passivhaus) is a voluntary standard for energy efficiency in a building, which reduces the building's ecological footprint. It results in ultra-low energy buildings that require little energy for space heating or cooling. A similar standard, MINERGIE-P, is used in Switzerland. The standard is not confined to residential properties; several office buildings, schools, kindergartens and a supermarket have also been constructed to the standard.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Energy conversion efficiencyEnergy conversion efficiency (η) is the ratio between the useful output of an energy conversion machine and the input, in energy terms. The input, as well as the useful output may be chemical, electric power, mechanical work, light (radiation), or heat. The resulting value, η (eta), ranges between 0 and 1. Energy conversion efficiency depends on the usefulness of the output. All or part of the heat produced from burning a fuel may become rejected waste heat if, for example, work is the desired output from a thermodynamic cycle.
Plasma (physics)Plasma () is one of four fundamental states of matter, characterized by the presence of a significant portion of charged particles in any combination of ions or electrons. It is the most abundant form of ordinary matter in the universe, being mostly associated with stars, including the Sun. Extending to the rarefied intracluster medium and possibly to intergalactic regions, plasma can be artificially generated by heating a neutral gas or subjecting it to a strong electromagnetic field.
Passive solar building designIn passive solar building design, windows, walls, and floors are made to collect, store, reflect, and distribute solar energy, in the form of heat in the winter and reject solar heat in the summer. This is called passive solar design because, unlike active solar heating systems, it does not involve the use of mechanical and electrical devices. The key to designing a passive solar building is to best take advantage of the local climate performing an accurate site analysis.
