Publications by Alessandro Vincenzi

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The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast therm ...

Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, v ...

With the rising challenges in heat removal in integrated circuits (ICs), the development of thermal-aware computing architectures and run-time management systems have become indispensable to the continuation of IC design scaling. These thermal-aware design ...

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

Temperature-driven floorplaners have been recently proposed to alleviate the thermal problem in 3D multi-processor systems-on-chip (MPSoC). However, the proposed algorithms fail to provide fast placement of the modules when the complexity and the number of ...

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract ...

Chip designers place on-chip thermal sensors to measure local temperatures, thus preventing thermal runaway situations in many-core processing architectures. However, the quality of the thermal reconstruction is directly dependent on the number of placed s ...

Chip designers place on-chip sensors to measure local temperatures, thus preventing thermal runaway situations in multicore processing architectures. However, thermal characterization is directly dependent on the number of placed sensors, which should be m ...

Alessandro Vincenzi

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Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

Fast and Scalable Temperature-driven Floorplan Design in 3D MPSoCs

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks

Near-optimal thermal monitoring framework for many-core systems on chip

EigenMaps: Algorithms for Optimal Thermal Maps Extraction and Sensor Placement on Multicore Processors