Arvind Raj Mahankali Sridhar

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Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

The soaring demand for computing power in our digital information age has produced as collateral undesirable effect a surge in power consumption and heat density for computing servers. Accordingly, 30-40% of the energy consumed in state-of-the-art servers ...

The development of embedded and interlayer liquid cooling in integrated circuits (ICs) using silicon microchannels has gained interest in the recent years owing to the rise of on-chip heat uses that aggravate thermal reliability issues of the emerging 3D s ...

The advent of 3D stacked ICs with accumulating heat fluxes stresses thermal reliability and is responsible for temperature driven performance deterioration of the electronic systems Hot spots with power densities typically rising up to 250 W/cm2 are not ac ...

Liquid-cooling using microchannel heat sinks etched on silicon dies is seen as a promising solution to the rising heat fluxes in two-dimensional and stacked three-dimensional integrated circuits. Development of such devices requires accurate and fast therm ...

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation ...

Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, v ...

As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold ...

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communica ...

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electr ...

With the rising challenges in heat removal in integrated circuits (ICs), the development of thermal-aware computing architectures and run-time management systems have become indispensable to the continuation of IC design scaling. These thermal-aware design ...

Heat removal is one of the major challenges faced in developing the new generation of high density integrated circuits. Future design technologies strongly depend on the availability of efficient means for thermal modeling and analysis. These thermal model ...

Integrated microfluidic power generation and power delivery promises to be a disruptive packaging technology with the potential to combat dark silicon. It essentially consists of integrated microchannel-based electrochemical “flow cells” in a 2D/3D multipr ...

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to addre ...

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract ...

Arvind Raj Mahankali Sridhar

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Thermal Simulation of Liquid-Cooled Integrated Circuits

Integrated Microfluidic Power Generation and Cooling for Bright Silicon MPSoCs

A semi-analytical approach for optimized design of microchannel liquid-cooled ICs

Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries

3D-ICE: a Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs

A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits

3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

Thermal modeling and analysis of 3D multi-processor chips

Through Silicon Via-Based Grid for Thermal Control in 3D Chips

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs

Fast Thermal Simulation of 2D/3D Integrated Circuits Exploiting Neural Networks and GPUs

PowerCool: Simulation of Integrated Microfluidic Power Generation in Bright Silicon MPSoCs

PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Accelerating Thermal Simulations of 3D ICs with Liquid Cooling using Neural Networks