Clemens Benedict Nyffeler

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Electronics today permeate our life and existence. It has become nearly impossible to evade any dependence on electronic devices that surround us every day - computers, phones, televisions. But also other objects become increasingly "smart" - watches, cars ...

In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connection pro ...

Scandium doped aluminium nitride (ScAlN) gained much attention during last years, since its piezoelectric response is much enlarged as compared to pure AlN films. Above 30% Sc the films are of high interest for piezoMEMS sensing and actuation, ultrasound g ...

The interest in MoS 2 for radio-frequency (RF) application has recently increased1'2. However, little is known on the scaling behavior of transistors made from MoS 2 for RF applications, which is important for establishing performance limits for electronic ...

Clemens Benedict Nyffeler

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Graphene Field Effect Devices and Circuits : Theory and Fabrication

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration

Non-destructive piezoelectric characterisation of Sc doped aluminium nitride thin films at wafer level

High-Frequency Scaled MoS2 Transistors

MoS2 Transistors Operating at Gigahertz Frequencies