GyroscopeA gyroscope (from Ancient Greek γῦρος gŷros, "round" and σκοπέω skopéō, "to look") is a device used for measuring or maintaining orientation and angular velocity. It is a spinning wheel or disc in which the axis of rotation (spin axis) is free to assume any orientation by itself. When rotating, the orientation of this axis is unaffected by tilting or rotation of the mounting, according to the conservation of angular momentum.
Vibrating structure gyroscopeA vibrating structure gyroscope, defined by the IEEE as a Coriolis vibratory gyroscope (CVG), is a gyroscope that uses a vibrating structure to determine the rate of rotation. A vibrating structure gyroscope functions much like the halteres of flies (insects in the order Diptera). The underlying physical principle is that a vibrating object tends to continue vibrating in the same plane even if its support rotates. The Coriolis effect causes the object to exert a force on its support, and by measuring this force the rate of rotation can be determined.
AccelerometerAn accelerometer is a tool that measures proper acceleration. Proper acceleration is the acceleration (the rate of change of velocity) of a body in its own instantaneous rest frame; this is different from coordinate acceleration, which is acceleration in a fixed coordinate system. For example, an accelerometer at rest on the surface of the Earth will measure an acceleration due to Earth's gravity, straight upwards (by definition) of g ≈ 9.81 m/s2. By contrast, accelerometers in free fall (falling toward the center of the Earth at a rate of about 9.
Ring laser gyroscopeA ring laser gyroscope (RLG) consists of a ring laser having two independent counter-propagating resonant modes over the same path; the difference in phase is used to detect rotation. It operates on the principle of the Sagnac effect which shifts the nulls of the internal standing wave pattern in response to angular rotation. Interference between the counter-propagating beams, observed externally, results in motion of the standing wave pattern, and thus indicates rotation.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Fibre-optic gyroscopeA fibre-optic gyroscope (FOG) senses changes in orientation using the Sagnac effect, thus performing the function of a mechanical gyroscope. However its principle of operation is instead based on the interference of light which has passed through a coil of optical fibre, which can be as long as . Two beams from a laser are injected into the same fibre but in opposite directions. Due to the Sagnac effect, the beam travelling against the rotation experiences a slightly shorter path delay than the other beam.
Inertial measurement unitAn inertial measurement unit (IMU) is an electronic device that measures and reports a body's specific force, angular rate, and sometimes the orientation of the body, using a combination of accelerometers, gyroscopes, and sometimes magnetometers. When the magnetometer is included, IMUs are referred to as IMMUs. IMUs are typically used to maneuver modern vehicles including motorcycles, missiles, aircraft (an attitude and heading reference system), including unmanned aerial vehicles (UAVs), among many others, and spacecraft, including satellites and landers.
Vacuum engineeringVacuum engineering is the field of engineering that deals with the practical use of vacuum in industrial and scientific applications. Vacuum may improve the productivity and performance of processes otherwise carried out at normal air pressure, or may make possible processes that could not be done in the presence of air. Vacuum engineering techniques are widely applied in materials processing such as drying or filtering, chemical processing, application of metal coatings to objects, manufacture of electron devices and incandescent lamps, and in scientific research.
Vacuum pumpA vacuum pump is a type of pump device that draws gas particles from a sealed volume in order to leave behind a partial vacuum. The first vacuum pump was invented in 1650 by Otto von Guericke, and was preceded by the suction pump, which dates to antiquity. The predecessor to the vacuum pump was the suction pump. Dual-action suction pumps were found in the city of Pompeii. Arabic engineer Al-Jazari later described dual-action suction pumps as part of water-raising machines in the 13th century.
Pressure measurementPressure measurement is the measurement of an applied force by a fluid (liquid or gas) on a surface. Pressure is typically measured in units of force per unit of surface area. Many techniques have been developed for the measurement of pressure and vacuum. Instruments used to measure and display pressure mechanically are called pressure gauges, vacuum gauges or compound gauges (vacuum & pressure). The widely used Bourdon gauge is a mechanical device, which both measures and indicates and is probably the best known type of gauge.
Ionic bondingIonic bonding is a type of chemical bonding that involves the electrostatic attraction between oppositely charged ions, or between two atoms with sharply different electronegativities, and is the primary interaction occurring in ionic compounds. It is one of the main types of bonding, along with covalent bonding and metallic bonding. Ions are atoms (or groups of atoms) with an electrostatic charge. Atoms that gain electrons make negatively charged ions (called anions). Atoms that lose electrons make positively charged ions (called cations).
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Inertial navigation systemAn inertial navigation system (INS) is a navigation device that uses motion sensors (accelerometers), rotation sensors (gyroscopes) and a computer to continuously calculate by dead reckoning the position, the orientation, and the velocity (direction and speed of movement) of a moving object without the need for external references. Often the inertial sensors are supplemented by a barometric altimeter and sometimes by magnetic sensors (magnetometers) and/or speed measuring devices.
Infrared spectroscopyInfrared spectroscopy (IR spectroscopy or vibrational spectroscopy) is the measurement of the interaction of infrared radiation with matter by absorption, emission, or reflection. It is used to study and identify chemical substances or functional groups in solid, liquid, or gaseous forms. It can be used to characterize new materials or identify and verify known and unknown samples. The method or technique of infrared spectroscopy is conducted with an instrument called an infrared spectrometer (or spectrophotometer) which produces an infrared spectrum.
Chemical bondA chemical bond is a lasting attraction between atoms or ions that enables the formation of molecules, crystals, and other structures. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds, or through the sharing of electrons as in covalent bonds. The strength of chemical bonds varies considerably; there are "strong bonds" or "primary bonds" such as covalent, ionic and metallic bonds, and "weak bonds" or "secondary bonds" such as dipole–dipole interactions, the London dispersion force, and hydrogen bonding.
Bond energyIn chemistry, bond energy (BE), also called the mean bond enthalpy or average bond enthalpy is a measure of bond strength in a chemical bond. IUPAC defines bond energy as the average value of the gas-phase bond-dissociation energy (usually at a temperature of 298.15 K) for all bonds of the same type within the same chemical species. The bond dissociation energy (enthalpy) is also referred to as bond disruption energy, bond energy, bond strength, or binding energy (abbreviation: BDE, BE, or D).
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
ElectrostaticsElectrostatics is a branch of physics that studies slow-moving or stationary electric charges. Since classical times, it has been known that some materials, such as amber, attract lightweight particles after rubbing. The Greek word for amber, ἤλεκτρον (), was thus the source of the word 'electricity'. Electrostatic phenomena arise from the forces that electric charges exert on each other. Such forces are described by Coulomb's law.
Fourier-transform infrared spectroscopyFourier-transform infrared spectroscopy (FTIR) is a technique used to obtain an infrared spectrum of absorption or emission of a solid, liquid, or gas. An FTIR spectrometer simultaneously collects high-resolution spectral data over a wide spectral range. This confers a significant advantage over a dispersive spectrometer, which measures intensity over a narrow range of wavelengths at a time. The term Fourier-transform infrared spectroscopy originates from the fact that a Fourier transform (a mathematical process) is required to convert the raw data into the actual spectrum.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
