Lecture

Failure Modes in MicroNanosystems: Understanding Fatigue and Fracture Strength

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In course

MICRO-470: Scaling laws in micro & nanosystems

This class adresses scaling laws in MEMS/NEMS. The dominant physical effects and scaling effects when downsizing sensors and actuators in microsystems are discussed, across a broad range of actuation principles. ...

Description

This lecture delves into the failure modes in MicroNanosystems, focusing on fatigue and fracture strength. It covers the concept of fatigue as a cycle-dependent decrease in yield strength, the impact of fluctuating loads on materials like steel, and the engineering challenges in Si springs for shock tolerance. The discussion also includes the fracture strength of different poly-Si layers and the effect of temperature on fracture. The lecture provides insights into the endurance limit of materials, the rare occurrence of fatigue in silicon compared to metal MEMS, and the Weibull failure probability plot for poly-silicon layers at various temperatures.

Instructors (3)

Philippe Renaud

Philippe Renaud is Professor at the Microsystem Laboratory (LMIS4) at EPFL. He is also the scientific director of the EPFL Center of MicroNanoTechnology (CMI). His main research area is related to micronano technologies in biomedical applications (BioMEMS) with emphasis on cell-chips, nanofluidics and bioelectronics. Ph. Renaud is invloved in many scientifics papers in his research area. He received his diploma in physics from the University of Neuchâtel (1983) and his Ph.D. degree from the University of Lausanne (1988). He was postdoctoral fellow at University of California, Berkeley (1988-89) and then at the IBM Zürich Research Laboratory in Switzerland (1990-91). In 1992, he joined the Sensors and Actuators group of the Swiss Center for Electronics and Microtechnology (CSEM) at Neuchâtel, Switzerland. He was appointed assistant professor at EPFL in 1994 and full professor in 1997. In summer 1996, he was visiting professor at the Tohoku University, Japan. Ph. Renaud is active in several scientific committee (scientific journals, international conferences, scientific advisory boards of companies, PhD thesis committee). He is also co-founder of the Nanotech-Montreux conference. Ph. Renaud is committed to valorization of basic research through his involvement in several high-tech start-up companies.

Niels Quack

Prof. Dr. Niels Quack received the M.Sc. degree from Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, in 2005, and the Dr.Sc. degree from Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, in 2010. From 2011 to 2015, he was Postdoctoral Researcher and Visiting Scholar with the Integrated Photonics Laboratory, Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. From 2014 to 2015, he was Senior MEMS Engineer with Sercalo Microtechnology, Neuchâtel, Switzerland. He is currently an SNSF Assistant Professor with Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland. He has authored and co-authored more than 50 papers in leading technical journals and conferences. His research interests include photonic micro and nanosystems, with an emphasis on diamond photonics and silicon photonic MEMS. He is Steering Committee Member of the IEEE International Conference on Optical MEMS and Nanophotonics (OMN) and served as General Chair of the IEEE OMN 2018 and the Latsis Symposium 2019 on Diamond Photonics. He is a Senior Member of IEEE, Member of The Optical Society (OSA) and life member of SPIE.

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Related concepts (19)

Failure rate

Failure rate is the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering. The failure rate of a system usually depends on time, with the rate varying over the life cycle of the system. For example, an automobile's failure rate in its fifth year of service may be many times greater than its failure rate during its first year of service.

Failure mode and effects analysis

Failure mode and effects analysis (FMEA; often written with "failure modes" in plural) is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects. For each component, the failure modes and their resulting effects on the rest of the system are recorded in a specific FMEA worksheet. There are numerous variations of such worksheets.

Failure cause

Failure causes are defects in design, process, quality, or part application, which are the underlying cause of a failure or which initiate a process which leads to failure. Where failure depends on the user of the product or process, then human error must be considered. A part failure mode is the way in which a component failed "functionally" on the component level. Often a part has only a few failure modes. For example, a relay may fail to open or close contacts on demand.

Fracture

Fracture is the separation of an object or material into two or more pieces under the action of stress. The fracture of a solid usually occurs due to the development of certain displacement discontinuity surfaces within the solid. If a displacement develops perpendicular to the surface, it is called a normal tensile crack or simply a crack; if a displacement develops tangentially, it is called a shear crack, slip band or dislocation. Brittle fractures occur without any apparent deformation before fracture.

Fracture toughness

In materials science, fracture toughness is the critical stress intensity factor of a sharp crack where propagation of the crack suddenly becomes rapid and unlimited. A component's thickness affects the constraint conditions at the tip of a crack with thin components having plane stress conditions and thick components having plane strain conditions. Plane strain conditions give the lowest fracture toughness value which is a material property.

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