Lecture

Advanced Cooling and Power Delivery Technologies

Graph Chat

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Description

This lecture discusses innovative technologies for cooling and power delivery to integrated circuits, including microchannels for fluid cooling and electrolytes for power supply. It explores the potential to cool up to 90 watts of energy and power cache processors, while reducing power consumption and increasing reliability using gravity-driven thermo siphon cooling.

This video is available exclusively on Mediaspace for a restricted audience. Please log in to MediaSpace to access it if you have the necessary permissions.

Watch on Mediaspace

Official source

Ontological neighbourhood

Mechanical engineering

Thermal engineering: Air conditioning

Related concepts (32)

Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.

Water cooling

Water cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.

Cooling tower

A cooling tower is a device that rejects waste heat to the atmosphere through the cooling of a coolant stream, usually a water stream, to a lower temperature. Cooling towers may either use the evaporation of water to remove process heat and cool the working fluid to near the wet-bulb air temperature or, in the case of dry cooling towers, rely solely on air to cool the working fluid to near the dry-bulb air temperature using radiators.

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

Integrated circuit

An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.

Related lectures (64)

Evaporative Cooling Innovations: Sustainable Solutions for High-Performance Cooling

Explores sustainable high-performance cooling through liquid-vapor phase change, novel materials, and innovative cooling systems, aiming to address the challenges of increasing cooling demand and carbon emissions.

Introduction to HVAC Systems

Covers the basics of HVAC systems, including thermal comfort assessment, psychrometric processes, and key components, with practical examples and exercises.

Thermal Conductivity: Experiments MOOC: Thermodynamics I

Covers experiments on thermal conductivity, cooling, phase shift, effusivity, and heat dissipation.

Energy-Efficient Data Centers

Explores the YINZ project's innovative solutions to reduce energy consumption in data centers through interdisciplinary collaborations and cutting-edge technologies.

Chip Packaging Process Flow: Major Steps