Very Large Scale IntegrationVery large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform.
Electronic design automationElectronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems such as integrated circuits and printed circuit boards. The tools work together in a design flow that chip designers use to design and analyze entire semiconductor chips. Since a modern semiconductor chip can have billions of components, EDA tools are essential for their design; this article in particular describes EDA specifically with respect to integrated circuits (ICs).
Printed circuit boardA printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
WireA wire is a flexible strand of metal. Wire is commonly formed by drawing the metal through a hole in a die or draw plate. Wire gauges come in various standard sizes, as expressed in terms of a gauge number or cross-sectional area. Wires are used to bear mechanical loads, often in the form of wire rope. In electricity and telecommunications signals, a "wire" can refer to an electrical cable, which can contain a "solid core" of a single wire or separate strands in stranded or braided forms.
Design rule checkingIn electronic design automation, a design rule is a geometric constraint imposed on circuit board, semiconductor device, and integrated circuit (IC) designers to ensure their designs function properly, reliably, and can be produced with acceptable yield. Design rules for production are developed by process engineers based on the capability of their processes to realize design intent. Electronic design automation is used extensively to ensure that designers do not violate design rules; a process called design rule checking (DRC).
CapacitanceCapacitance is the capability of a material object or device to store electric charge. It is measured by the charge in response to a difference in electric potential, expressed as the ratio of those quantities. Commonly recognized are two closely related notions of capacitance: self capacitance and mutual capacitance. An object that can be electrically charged exhibits self capacitance, for which the electric potential is measured between the object and ground.
Clock signalIn electronics and especially synchronous digital circuits, a clock signal (historically also known as logic beat) is an electronic logic signal (voltage or current) which oscillates between a high and a low state at a constant frequency and is used like a metronome to synchronize actions of digital circuits. In a synchronous logic circuit, the most common type of digital circuit, the clock signal is applied to all storage devices, flip-flops and latches, and causes them all to change state simultaneously, preventing race conditions.
ElectromigrationElectromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases.
Routing (electronic design automation)In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement, which determines the location of each active element of an IC or component on a PCB. After placement, the routing step adds wires needed to properly connect the placed components while obeying all design rules for the IC. Together, the placement and routing steps of IC design are known as place and route.
Wire bondingWire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Clock rateIn computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed. It is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers (PCs) to arrive throughout the 1970s and 1980s had clock rates measured in megahertz (MHz), and in the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz).
CapacitorA capacitor is a device that stores electrical energy in an electric field by accumulating electric charges on two closely spaced surfaces that are insulated from each other. It is a passive electronic component with two terminals. The effect of a capacitor is known as capacitance. While some capacitance exists between any two electrical conductors in proximity in a circuit, a capacitor is a component designed to add capacitance to a circuit.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Clock skewClock skew (sometimes called timing skew) is a phenomenon in synchronous digital circuit systems (such as computer systems) in which the same sourced clock signal arrives at different components at different times due to gate or, in more advanced semiconductor technology, wire signal propagation delay. The instantaneous difference between the readings of any two clocks is called their skew. The operation of most digital circuits is synchronized by a periodic signal known as a "clock" that dictates the sequence and pacing of the devices on the circuit.
Capacitor typesCapacitors are manufactured in many styles, forms, dimensions, and from a large variety of materials. They all contain at least two electrical conductors, called plates, separated by an insulating layer (dielectric). Capacitors are widely used as parts of electrical circuits in many common electrical devices. Capacitors, together with resistors and inductors, belong to the group of passive components in electronic equipment.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Parasitic capacitanceParasitic capacitance is an unavoidable and usually unwanted capacitance that exists between the parts of an electronic component or circuit simply because of their proximity to each other. When two electrical conductors at different voltages are close together, the electric field between them causes electric charge to be stored on them; this effect is capacitance. All practical circuit elements such as inductors, diodes, and transistors have internal capacitance, which can cause their behavior to depart from that of ideal circuit elements.
OSI modelThe Open Systems Interconnection model (OSI model) is a conceptual model from the International Organization for Standardization (ISO) that "provides a common basis for the coordination of standards development for the purpose of systems interconnection." In the OSI reference model, the communications between a computing system are split into seven different abstraction layers: Physical, Data Link, Network, Transport, Session, Presentation, and Application.
Ceramic capacitorA ceramic capacitor is a fixed-value capacitor where the ceramic material acts as the dielectric. It is constructed of two or more alternating layers of ceramic and a metal layer acting as the electrodes. The composition of the ceramic material defines the electrical behavior and therefore applications. Ceramic capacitors are divided into two application classes: Class 1 ceramic capacitors offer high stability and low losses for resonant circuit applications.
