Lecture

Electro-Thermo-Mechanical Analysis: Scaling Laws & Simulations

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In course

MICRO-470: Scaling laws in micro & nanosystems

This class adresses scaling laws in MEMS/NEMS. The dominant physical effects and scaling effects when downsizing sensors and actuators in microsystems are discussed, across a broad range of actuation principles. ...

Description

This lecture covers the analysis of electro-thermo-mechanical systems in micro and nanosystems, focusing on topics such as thermal bimorphs, coefficient of thermal expansion, temperature-dependent material properties, and device profile analyses. The instructor explains the multiphysics simulations, electro-thermo-mechanical coupling, and the effects of temperature on material properties. Various actuators like hot-arm, cold-arm, and V-type/chevron actuators are discussed, along with the simulation of deflection in cantilevers with different materials. The lecture also delves into thermomechanical actuators, coupled field problems, and one-way vs. two-way coupling in simulations, emphasizing the interplay between electrical, thermal, and structural aspects in microactuators.

Instructors (3)

Philippe Renaud

Philippe Renaud is Professor at the Microsystem Laboratory (LMIS4) at EPFL. He is also the scientific director of the EPFL Center of MicroNanoTechnology (CMI). His main research area is related to micronano technologies in biomedical applications (BioMEMS) with emphasis on cell-chips, nanofluidics and bioelectronics. Ph. Renaud is invloved in many scientifics papers in his research area. He received his diploma in physics from the University of Neuchâtel (1983) and his Ph.D. degree from the University of Lausanne (1988). He was postdoctoral fellow at University of California, Berkeley (1988-89) and then at the IBM Zürich Research Laboratory in Switzerland (1990-91). In 1992, he joined the Sensors and Actuators group of the Swiss Center for Electronics and Microtechnology (CSEM) at Neuchâtel, Switzerland. He was appointed assistant professor at EPFL in 1994 and full professor in 1997. In summer 1996, he was visiting professor at the Tohoku University, Japan. Ph. Renaud is active in several scientific committee (scientific journals, international conferences, scientific advisory boards of companies, PhD thesis committee). He is also co-founder of the Nanotech-Montreux conference. Ph. Renaud is committed to valorization of basic research through his involvement in several high-tech start-up companies.

Niels Quack

Prof. Dr. Niels Quack received the M.Sc. degree from Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, in 2005, and the Dr.Sc. degree from Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, in 2010. From 2011 to 2015, he was Postdoctoral Researcher and Visiting Scholar with the Integrated Photonics Laboratory, Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. From 2014 to 2015, he was Senior MEMS Engineer with Sercalo Microtechnology, Neuchâtel, Switzerland. He is currently an SNSF Assistant Professor with Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland. He has authored and co-authored more than 50 papers in leading technical journals and conferences. His research interests include photonic micro and nanosystems, with an emphasis on diamond photonics and silicon photonic MEMS. He is Steering Committee Member of the IEEE International Conference on Optical MEMS and Nanophotonics (OMN) and served as General Chair of the IEEE OMN 2018 and the Latsis Symposium 2019 on Diamond Photonics. He is a Senior Member of IEEE, Member of The Optical Society (OSA) and life member of SPIE.

Official source

Related concepts (5)

Thermomechanical analysis

Thermomechanical analysis (TMA) is a technique used in thermal analysis, a branch of materials science which studies the properties of materials as they change with temperature. Thermomechanical analysis is a subdiscipline of the thermomechanometry (TM) technique. Thermomechanometry is the measurement of a change of a dimension or a mechanical property of the sample while it is subjected to a temperature regime. An associated thermoanalytical method is thermomechanical analysis.

Thermal analysis

Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature.

Temperature

Temperature is a physical quantity that expresses quantitatively the perceptions of hotness and coldness. Temperature is measured with a thermometer. Thermometers are calibrated in various temperature scales that historically have relied on various reference points and thermometric substances for definition. The most common scales are the Celsius scale with the unit symbol °C (formerly called centigrade), the Fahrenheit scale (°F), and the Kelvin scale (K), the latter being used predominantly for scientific purposes.

Thermodynamic temperature

Thermodynamic temperature is a quantity defined in thermodynamics as distinct from kinetic theory or statistical mechanics. Historically, thermodynamic temperature was defined by Lord Kelvin in terms of a macroscopic relation between thermodynamic work and heat transfer as defined in thermodynamics, but the kelvin was redefined by international agreement in 2019 in terms of phenomena that are now understood as manifestations of the kinetic energy of free motion of microscopic particles such as atoms, molecules, and electrons.

Mechanical engineering

Mechanical engineering is the study of physical machines that may involve force and movement. It is an engineering branch that combines engineering physics and mathematics principles with materials science, to design, analyze, manufacture, and maintain mechanical systems. It is one of the oldest and broadest of the engineering branches. Mechanical engineering requires an understanding of core areas including mechanics, dynamics, thermodynamics, materials science, design, structural analysis, and electricity.

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