Stress–strain curveIn engineering and materials science, a stress–strain curve for a material gives the relationship between stress and strain. It is obtained by gradually applying load to a test coupon and measuring the deformation, from which the stress and strain can be determined (see tensile testing). These curves reveal many of the properties of a material, such as the Young's modulus, the yield strength and the ultimate tensile strength. Generally speaking, curves representing the relationship between stress and strain in any form of deformation can be regarded as stress–strain curves.
Input impedanceThe input impedance of an electrical network is the measure of the opposition to current (impedance), both static (resistance) and dynamic (reactance), into a load network that is external to the electrical source network. The input admittance (the reciprocal of impedance) is a measure of the load network's propensity to draw current. The source network is the portion of the network that transmits power, and the load network is the portion of the network that consumes power.
Decoupling capacitorIn electronics, a decoupling capacitor is a capacitor used to decouple (i.e. prevent electrical energy from transferring to) one part of a circuit from another. Noise caused by other circuit elements is shunted through the capacitor, reducing its effect on the rest of the circuit. For higher frequencies, an alternative name is bypass capacitor as it is used to bypass the power supply or other high-impedance component of a circuit. Active devices of an electronic system (e.g.
Output impedanceThe output impedance of an electrical network is the measure of the opposition to current flow (impedance), both static (resistance) and dynamic (reactance), into the load network being connected that is internal to the electrical source. The output impedance is a measure of the source's propensity to drop in voltage when the load draws current, the source network being the portion of the network that transmits and the load network being the portion of the network that consumes.
Capacitor typesCapacitors are manufactured in many styles, forms, dimensions, and from a large variety of materials. They all contain at least two electrical conductors, called plates, separated by an insulating layer (dielectric). Capacitors are widely used as parts of electrical circuits in many common electrical devices. Capacitors, together with resistors and inductors, belong to the group of passive components in electronic equipment.
Impedance bridgingIn audio engineering and sound recording, a high impedance bridging, voltage bridging, or simply bridging connection is one in which the load impedance is much larger than the source impedance. The load measures the source's voltage while minimally drawing current or affecting it. When the output of a device (consisting of the voltage source VS and output impedance ZS in illustration) is connected to the input of another device (the load impedance ZL in the illustration), these two impedances form a voltage divider: One can maximize the signal level VL by using a voltage source whose output impedance ZS is as small as possible and by using a receiving device whose input impedance ZL is as large as possible.
Impedance matchingIn electronics, impedance matching is the practice of designing or adjusting the input impedance or output impedance of an electrical device for a desired value. Often, the desired value is selected to maximize power transfer or minimize signal reflection. For example, impedance matching typically is used to improve power transfer from a radio transmitter via the interconnecting transmission line to the antenna. Signals on a transmission line will be transmitted without reflections if the transmission line is terminated with a matching impedance.
Electrical impedanceIn electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit. Quantitatively, the impedance of a two-terminal circuit element is the ratio of the complex representation of the sinusoidal voltage between its terminals, to the complex representation of the current flowing through it. In general, it depends upon the frequency of the sinusoidal voltage.
Ceramic capacitorA ceramic capacitor is a fixed-value capacitor where the ceramic material acts as the dielectric. It is constructed of two or more alternating layers of ceramic and a metal layer acting as the electrodes. The composition of the ceramic material defines the electrical behavior and therefore applications. Ceramic capacitors are divided into two application classes: Class 1 ceramic capacitors offer high stability and low losses for resonant circuit applications.
CapacitorA capacitor is a device that stores electrical energy in an electric field by accumulating electric charges on two closely spaced surfaces that are insulated from each other. It is a passive electronic component with two terminals. The effect of a capacitor is known as capacitance. While some capacitance exists between any two electrical conductors in proximity in a circuit, a capacitor is a component designed to add capacitance to a circuit.
Stress–strain analysisStress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other, while strain is the measure of the deformation of the material. In simple terms we can define stress as the force of resistance per unit area, offered by a body against deformation.
Capacitive couplingCapacitive coupling is the transfer of energy within an electrical network or between distant networks by means of displacement current between circuit(s) nodes, induced by the electric field. This coupling can have an intentional or accidental effect. In its simplest implementation, capacitive coupling is achieved by placing a capacitor between two nodes. Where analysis of many points in a circuit is carried out, the capacitance at each point and between points can be described in a matrix form.
Applications of capacitorsCapacitors have many uses in electronic and electrical systems. They are so ubiquitous that it is rare that an electrical product does not include at least one for some purpose. Capacitors allow only AC signals to pass when they are charged blocking DC signals. The main components of filters are capacitors. Capacitors have the ability to connect one circuit segment to another. Capacitors are used by Dynamic Random Access Memory (DRAM) devices to represent binary information as bits.
Current sourceA current source is an electronic circuit that delivers or absorbs an electric current which is independent of the voltage across it. A current source is the dual of a voltage source. The term current sink is sometimes used for sources fed from a negative voltage supply. Figure 1 shows the schematic symbol for an ideal current source driving a resistive load. There are two types. An independent current source (or sink) delivers a constant current. A dependent current source delivers a current which is proportional to some other voltage or current in the circuit.
SemiconductorA semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created.
Substrate (materials science)Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. This surface could be used to produce new film or layers of material such as deposited coatings. It could be the base to which paint, adhesives, or adhesive tape is bonded. A typical substrate might be rigid such as metal, concrete, or glass, onto which a coating might be deposited. Flexible substrates are also used. With all coating processes, the condition of the surface of the substrate can strongly affect the bond of subsequent layers.
Smith chartThe Smith chart (sometimes also called Smith diagram, Mizuhashi chart (水橋チャート), Mizuhashi–Smith chart (水橋スミスチャート), Volpert–Smith chart (Диаграмма Вольперта—Смита) or Mizuhashi–Volpert–Smith chart), is a graphical calculator or nomogram designed for electrical and electronics engineers specializing in radio frequency (RF) engineering to assist in solving problems with transmission lines and matching circuits. It was independently proposed by Tōsaku Mizuhashi (水橋東作) in 1937, and by Amiel R. Volpert (Амиэ́ль Р.
Plasticity (physics)In physics and materials science, plasticity (also known as plastic deformation) is the ability of a solid material to undergo permanent deformation, a non-reversible change of shape in response to applied forces. For example, a solid piece of metal being bent or pounded into a new shape displays plasticity as permanent changes occur within the material itself. In engineering, the transition from elastic behavior to plastic behavior is known as yielding. Plastic deformation is observed in most materials, particularly metals, soils, rocks, concrete, and foams.
Materials scienceMaterials science is an interdisciplinary field of researching and discovering materials. Materials engineering is an engineering field of finding uses for materials in other fields and industries. The intellectual origins of materials science stem from the Age of Enlightenment, when researchers began to use analytical thinking from chemistry, physics, and engineering to understand ancient, phenomenological observations in metallurgy and mineralogy. Materials science still incorporates elements of physics, chemistry, and engineering.
Thin-film solar cellThin-film solar cells are made by depositing one or more thin layers (thin films or TFs) of photovoltaic material onto a substrate, such as glass, plastic or metal. Thin-film solar cells are typically a few nanometers (nm) to a few microns (μm) thick–much thinner than the wafers used in conventional crystalline silicon (c-Si) based solar cells, which can be up to 200 μm thick. Thin-film solar cells are commercially used in several technologies, including cadmium telluride (CdTe), copper indium gallium diselenide (CIGS), and amorphous thin-film silicon (a-Si, TF-Si).
