Grain boundaryIn materials science, a grain boundary is the interface between two grains, or crystallites, in a polycrystalline material. Grain boundaries are two-dimensional defects in the crystal structure, and tend to decrease the electrical and thermal conductivity of the material. Most grain boundaries are preferred sites for the onset of corrosion and for the precipitation of new phases from the solid. They are also important to many of the mechanisms of creep.
Abnormal grain growthAbnormal or discontinuous grain growth, also referred to as exaggerated or secondary recrystallisation grain growth, is a grain growth phenomenon through which certain energetically favorable grains (crystallites) grow rapidly in a matrix of finer grains resulting in a bimodal grain size distribution. In ceramic materials this phenomenon can result in the formation of elongated prismatic, acicular (needle-like) grains in a densified matrix with implications for improved fracture toughness through the impedance of crack propagation.
Grain growthIn materials science, grain growth is the increase in size of grains (crystallites) in a material at high temperature. This occurs when recovery and recrystallisation are complete and further reduction in the internal energy can only be achieved by reducing the total area of grain boundary. The term is commonly used in metallurgy but is also used in reference to ceramics and minerals. The behaviors of grain growth is analogous to the coarsening behaviors of grains, which implied that both of grain growth and coarsening may be dominated by the same physical mechanism.
CrystalliteA crystallite is a small or even microscopic crystal which forms, for example, during the cooling of many materials. Crystallites are also referred to as grains. Bacillite is a type of crystallite. It is rodlike with parallel longulites. The orientation of crystallites can be random with no preferred direction, called random texture, or directed, possibly due to growth and processing conditions.
SinteringSintering or frittage is the process of compacting and forming a solid mass of material by pressure or heat without melting it to the point of liquefaction. Sintering happens as part of a manufacturing process used with metals, ceramics, plastics, and other materials. The nanoparticles in the sintered material diffuse across the boundaries of the particles, fusing the particles together and creating a solid piece.
Recrystallization (metallurgy)In materials science, recrystallization is a process by which deformed grains are replaced by a new set of defect-free grains that nucleate and grow until the original grains have been entirely consumed. Recrystallization is usually accompanied by a reduction in the strength and hardness of a material and a simultaneous increase in the ductility. Thus, the process may be introduced as a deliberate step in metals processing or may be an undesirable byproduct of another processing step.
Grain boundary strengtheningIn materials science, grain-boundary strengthening (or Hall–Petch strengthening) is a method of strengthening materials by changing their average crystallite (grain) size. It is based on the observation that grain boundaries are insurmountable borders for dislocations and that the number of dislocations within a grain has an effect on how stress builds up in the adjacent grain, which will eventually activate dislocation sources and thus enabling deformation in the neighbouring grain as well.
TaskbarThe Taskbar is a graphical user interface element that has been part of Microsoft Windows since Windows 95, displaying and facilitating switching between running programs. The Taskbar and the associated Start Menu were created and named in 1993 by Daniel Oran, a program manager at Microsoft who had previously collaborated on Great ape language research with the behavioral psychologist B.F. Skinner at Harvard. The Taskbar is an exemplar of a category of always-visible graphical user interface elements that provide access to fundamental operating system functions and information.
Creep (deformation)In materials science, creep (sometimes called cold flow) is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point. The rate of deformation is a function of the material's properties, exposure time, exposure temperature and the applied structural load.
CeramographyCeramography is the art and science of preparation, examination and evaluation of ceramic microstructures. Ceramography can be thought of as the metallography of ceramics. The microstructure is the structure level of approximately 0.1 to 100 μm, between the minimum wavelength of visible light and the resolution limit of the naked eye. The microstructure includes most grains, secondary phases, grain boundaries, pores, micro-cracks and hardness microindentations.
Windows shellThe Windows shell is the graphical user interface for the Microsoft Windows operating system. Its readily identifiable elements consist of the desktop, the taskbar, the Start menu, the task switcher and the AutoPlay feature. On some versions of Windows, it also includes Flip 3D and the charms. In Windows 10, the Windows Shell Experience Host interface drives visuals like the Start Menu, Action Center, Taskbar, and Task View/Timeline.
Recovery (metallurgy)In metallurgy, recovery is a process by which a metal or alloy's deformed grains can reduce their stored energy by the removal or rearrangement of defects in their crystal structure. These defects, primarily dislocations, are introduced by plastic deformation of the material and act to increase the yield strength of a material. Since recovery reduces the dislocation density, the process is normally accompanied by a reduction in a material's strength and a simultaneous increase in the ductility.
MetallographyMetallography is the study of the physical structure and components of metals, by using microscopy. Ceramic and polymeric materials may also be prepared using metallographic techniques, hence the terms ceramography, plastography and, collectively, materialography. The surface of a metallographic specimen is prepared by various methods of grinding, polishing, and etching. After preparation, it is often analyzed using optical or electron microscopy. Using only metallographic techniques, a skilled technician can identify alloys and predict material properties.
Window managerA window manager is system software that controls the placement and appearance of windows within a windowing system in a graphical user interface. Most window managers are designed to help provide a desktop environment. They work in conjunction with the underlying graphical system that provides required functionality—support for graphics hardware, pointing devices, and a keyboard—and are often written and created using a widget toolkit. Few window managers are designed with a clear distinction between the windowing system and the window manager.
Ceramic engineeringCeramic engineering is the science and technology of creating objects from inorganic, non-metallic materials. This is done either by the action of heat, or at lower temperatures using precipitation reactions from high-purity chemical solutions. The term includes the purification of raw materials, the study and production of the chemical compounds concerned, their formation into components and the study of their structure, composition and properties. Ceramic materials may have a crystalline or partly crystalline structure, with long-range order on atomic scale.
PorosityPorosity or void fraction is a measure of the void (i.e. "empty") spaces in a material, and is a fraction of the volume of voids over the total volume, between 0 and 1, or as a percentage between 0% and 100%. Strictly speaking, some tests measure the "accessible void", the total amount of void space accessible from the surface (cf. closed-cell foam). There are many ways to test porosity in a substance or part, such as industrial CT scanning.
Features new to Windows 7Some of the new features included in Windows 7 are advancements in touch, speech and handwriting recognition, support for , support for additional s, improved performance on multi-core processors, improved boot performance, and kernel improvements. Windows 7 retains the Windows Aero graphical user interface and visual style introduced in its predecessor, Windows Vista, but many areas have seen enhancements. Unlike Windows Vista, window borders and the taskbar do not turn opaque when a window is maximized while Windows Aero is active; instead, they remain translucent.
Pore space in soilThe pore space of soil contains the liquid and gas phases of soil, i.e., everything but the solid phase that contains mainly minerals of varying sizes as well as organic compounds. In order to understand porosity better a series of equations have been used to express the quantitative interactions between the three phases of soil. Macropores or fractures play a major role in infiltration rates in many soils as well as preferential flow patterns, hydraulic conductivity and evapotranspiration.
SuperalloyA superalloy, or high-performance alloy, is an alloy with the ability to operate at a high fraction of its melting point. Key characteristics of a superalloy include mechanical strength, thermal creep deformation resistance, surface stability, and corrosion and oxidation resistance. The crystal structure is typically face-centered cubic (FCC) austenitic. Examples of such alloys are Hastelloy, Inconel, Waspaloy, Rene alloys, Incoloy, MP98T, TMS alloys, and CMSX single crystal alloys.
Doping (semiconductor)In semiconductor production, doping is the intentional introduction of impurities into an intrinsic semiconductor for the purpose of modulating its electrical, optical and structural properties. The doped material is referred to as an extrinsic semiconductor. Small numbers of dopant atoms can change the ability of a semiconductor to conduct electricity. When on the order of one dopant atom is added per 100 million atoms, the doping is said to be low or light.
