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This lecture discusses the behavior of a thin film on a substrate under thermal expansion mismatch, exploring the stresses in the film and substrate as a function of temperature change and material properties. It covers the concept of equal displacements and strains, the effects near the edges, and the existence of shear stresses along the interface. The lecture also delves into the equations of linear elasticity for static problems with small strain, emphasizing the importance of force balance and the deformation of bimaterial systems. Practical applications, such as metallization of Si for microelectronics, are presented to illustrate the theoretical concepts.
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