Lecture

Laser Ablation and Excimer Lasers

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In course

MICRO-520: Laser microprocessing

The physical principles of laser light materials interactions are introduced with a large number of industrial application examples. Materials processing lasers are developing further and further, the lecture presents the physical limitations of the proces ...

Description

This lecture covers the applications of laser ablation in materials processing, including various techniques such as pulsed laser ablation, laser types (pulsed & CW), and Q-switching. It also delves into the technical specifications of excimer lasers, their interaction with materials, and their wide range of applications in microelectronic production, thin film ablation, and rapid prototyping.

Instructor

Patrik Willi Hoffmann

Expertise WettabilityMico-structuringElectron-beam DepositionPhotodepositionPhotoablationNano-optics Mission Patrik Hoffmann is heading the laboratory for Advanced Materials Processing at Empa. Laser materials processing including Additive Manufacturing are key topics in recent years.At the EPFL cite in the Laboratory for Optical Materials and Characterization LPMAT, novel functional material depositions by HV-CVD are studied. Recently BaTiO3 heteroepitaxial films have been grown on SrTiO3 buffered silicon

Official source

Ontological neighbourhood

Physics

Optics: Lasers

Related concepts (27)

Laser ablation

Laser ablation or photoablation (also called laser blasting) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave laser beam if the laser intensity is high enough.

Laser

A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation. The word laser is an anacronym that originated as an acronym for light amplification by stimulated emission of radiation. The first laser was built in 1960 by Theodore Maiman at Hughes Research Laboratories, based on theoretical work by Charles H. Townes and Arthur Leonard Schawlow. A laser differs from other sources of light in that it emits light that is coherent.

Excimer laser

An excimer laser, sometimes more correctly called an exciplex laser, is a form of ultraviolet laser which is commonly used in the production of microelectronic devices, semiconductor based integrated circuits or "chips", eye surgery, and micromachining. Since 1960s excimer lasers are widely used in high-resolution photolithography machines, one of the critical technologies required for microelectronic chip manufacturing. The term excimer is short for 'excited dimer', while exciplex is short for 'excited complex'.

Laser diode

A laser diode (LD, also injection laser diode or ILD, or diode laser) is a semiconductor device similar to a light-emitting diode in which a diode pumped directly with electrical current can create lasing conditions at the diode's junction. Driven by voltage, the doped p–n-transition allows for recombination of an electron with a hole. Due to the drop of the electron from a higher energy level to a lower one, radiation, in the form of an emitted photon is generated. This is spontaneous emission.

Ablation

Ablation (ablatio – removal) is the removal or destruction of something from an object by vaporization, chipping, erosive processes, or by other means. Examples of ablative materials are described below, including spacecraft material for ascent and atmospheric reentry, ice and snow in glaciology, biological tissues in medicine and passive fire protection materials. In artificial intelligence (AI), especially machine learning, ablation is the removal of a component of an AI system.

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