Thermal conductionConduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.
Biot numberThe Biot number (Bi) is a dimensionless quantity used in heat transfer calculations, named for the eighteenth-century French physicist Jean-Baptiste Biot (1774–1862). The Biot number is the ratio of the thermal resistance for conduction inside a body to the resistance for convection at the surface of the body. This ratio indicates whether the temperature inside a body varies significantly in space when the body is heated or cooled over time by a heat flux at its surface.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
Heat transferHeat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
HeatIn thermodynamics, heat is the thermal energy transferred between systems due to a temperature difference. In colloquial use, heat sometimes refers to thermal energy itself. An example of formal vs. informal usage may be obtained from the right-hand photo, in which the metal bar is "conducting heat" from its hot end to its cold end, but if the metal bar is considered a thermodynamic system, then the energy flowing within the metal bar is called internal energy, not heat.
Convection (heat transfer)Convection (or convective heat transfer) is the transfer of heat from one place to another due to the movement of fluid. Although often discussed as a distinct method of heat transfer, convective heat transfer involves the combined processes of conduction (heat diffusion) and advection (heat transfer by bulk fluid flow). Convection is usually the dominant form of heat transfer in liquids and gases. Note that this definition of convection is only applicable in Heat transfer and thermodynamic contexts.
Thermal insulationThermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials. Heat flow is an inevitable consequence of contact between objects of different temperature.
Thermal conductivityThe thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.
Lumped-element modelThe lumped-element model (also called lumped-parameter model, or lumped-component model) is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems (including electronics), mechanical multibody systems, heat transfer, acoustics, etc.
Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Fourier numberIn the study of heat conduction, the Fourier number, is the ratio of time, , to a characteristic time scale for heat diffusion, . This dimensionless group is named in honor of J.B.J. Fourier, who formulated the modern understanding of heat conduction. The time scale for diffusion characterizes the time needed for heat to diffuse over a distance, . For a medium with thermal diffusivity, , this time scale is , so that the Fourier number is . The Fourier number is often denoted as or .
Newton's law of coolingIn the study of heat transfer, Newton's law of cooling is a physical law which states that The rate of heat loss of a body is directly proportional to the difference in the temperatures between the body and its environment. The law is frequently qualified to include the condition that the temperature difference is small and the nature of heat transfer mechanism remains the same. As such, it is equivalent to a statement that the heat transfer coefficient, which mediates between heat losses and temperature differences, is a constant.
Relativistic heat conductionRelativistic heat conduction refers to the modelling of heat conduction (and similar diffusion processes) in a way compatible with special relativity. In special (and general) relativity, the usual heat equation for non-relativistic heat conduction must be modified, as it leads to faster-than-light signal propagation. Relativistic heat conduction, therefore, encompasses a set of models for heat propagation in continuous media (solids, fluids, gases) that are consistent with relativistic causality, namely the principle that an effect must be within the light-cone associated to its cause.
Thermal contact conductanceIn physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient, , is a property indicating the thermal conductivity, or ability to conduct heat, between two bodies in contact. The inverse of this property is termed thermal contact resistance. When two solid bodies come in contact, such as A and B in Figure 1, heat flows from the hotter body to the colder body.
Heat pumpA heat pump is a device that uses work to transfer heat from a cool space to a warm space by transferring thermal energy using a refrigeration cycle, cooling the cool space and warming the warm space. In cold weather a heat pump can move heat from the cool outdoors to warm a house; the pump may also be designed to move heat from the house to the warmer outdoors in warm weather. As they transfer heat rather than generating heat, they are more energy-efficient than other ways of heating a home.
Distributed-element modelIn electrical engineering, the distributed-element model or transmission-line model of electrical circuits assumes that the attributes of the circuit (resistance, capacitance, and inductance) are distributed continuously throughout the material of the circuit. This is in contrast to the more common lumped-element model, which assumes that these values are lumped into electrical components that are joined by perfectly conducting wires.
Heat transfer coefficientIn thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).
Ground source heat pumpA ground source heat pump (also geothermal heat pump) is a heating/cooling system for buildings that uses a type of heat pump to transfer heat to or from the ground, taking advantage of the relative constancy of temperatures of the earth through the seasons. Ground source heat pumps (GSHPs) – or geothermal heat pumps (GHP) as they are commonly termed in North America – are among the most energy-efficient technologies for providing HVAC and water heating, using far less energy than can be achieved by burning a fuel in a boiler/furnace or by use of resistive electric heaters.
Air source heat pumpAn air source heat pump (ASHP) is a type of heat pump that can absorb heat from outside a structure and release it inside using the same vapor-compression refrigeration process and much the same equipment as air conditioners but used in the opposite direction. Unlike an air conditioning unit, most ASHPs are reversible and are able to either warm or cool buildings and in some cases also provide domestic hot water. In a typical setting, an ASHP can gain 4 kWh thermal energy from 1 kWh electric energy.
Thermal radiationThermal radiation is electromagnetic radiation generated by the thermal motion of particles in matter. Thermal radiation is generated when heat from the movement of charges in the material (electrons and protons in common forms of matter) is converted to electromagnetic radiation. All matter with a temperature greater than absolute zero emits thermal radiation. At room temperature, most of the emission is in the infrared (IR) spectrum. Particle motion results in charge-acceleration or dipole oscillation which produces electromagnetic radiation.