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Lecture

Thermal Effects

In course

MICRO-470: Scaling laws in micro & nanosystems

This class adresses scaling laws in MEMS/NEMS. The dominant physical effects and scaling effects when downsizing sensors and actuators in microsystems are discussed, across a broad range of actuation principles. ...

Description

This lecture covers topics related to thermal effects in micro and nanosystems, including gas conduction, thermal conductance, radiative heat transfer, temperature fluctuations, heat losses in micromachined bolometers, and thermal accelerometers. It discusses the competition between conduction and convection losses, the impact of small gaps on thermal conductivity, and the influence of radiation on heat transfer coefficients. The ultimate resolution limitation in MEMS bolometers due to radiation conduction is also explored, along with strategies to modulate thermal parameters for improved sensitivity and bandwidth control.

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Instructors (3)

Philippe Renaud

Philippe Renaud is Professor at the Microsystem Laboratory (LMIS4) at EPFL. He is also the scientific director of the EPFL Center of MicroNanoTechnology (CMI). His main research area is related to micronano technologies in biomedical applications (BioMEMS) with emphasis on cell-chips, nanofluidics and bioelectronics. Ph. Renaud is invloved in many scientifics papers in his research area. He received his diploma in physics from the University of Neuchâtel (1983) and his Ph.D. degree from the University of Lausanne (1988). He was postdoctoral fellow at University of California, Berkeley (1988-89) and then at the IBM Zürich Research Laboratory in Switzerland (1990-91). In 1992, he joined the Sensors and Actuators group of the Swiss Center for Electronics and Microtechnology (CSEM) at Neuchâtel, Switzerland. He was appointed assistant professor at EPFL in 1994 and full professor in 1997. In summer 1996, he was visiting professor at the Tohoku University, Japan. Ph. Renaud is active in several scientific committee (scientific journals, international conferences, scientific advisory boards of companies, PhD thesis committee). He is also co-founder of the Nanotech-Montreux conference. Ph. Renaud is committed to valorization of basic research through his involvement in several high-tech start-up companies.

Niels Quack

Prof. Dr. Niels Quack received the M.Sc. degree from Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, in 2005, and the Dr.Sc. degree from Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, in 2010. From 2011 to 2015, he was Postdoctoral Researcher and Visiting Scholar with the Integrated Photonics Laboratory, Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. From 2014 to 2015, he was Senior MEMS Engineer with Sercalo Microtechnology, Neuchâtel, Switzerland. He is currently an SNSF Assistant Professor with Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland. He has authored and co-authored more than 50 papers in leading technical journals and conferences. His research interests include photonic micro and nanosystems, with an emphasis on diamond photonics and silicon photonic MEMS. He is Steering Committee Member of the IEEE International Conference on Optical MEMS and Nanophotonics (OMN) and served as General Chair of the IEEE OMN 2018 and the Latsis Symposium 2019 on Diamond Photonics. He is a Senior Member of IEEE, Member of The Optical Society (OSA) and life member of SPIE.

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Related concepts (19)

Thermal conduction

Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.

Heat transfer

Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.

Convection (heat transfer)

Convection (or convective heat transfer) is the transfer of heat from one place to another due to the movement of fluid. Although often discussed as a distinct method of heat transfer, convective heat transfer involves the combined processes of conduction (heat diffusion) and advection (heat transfer by bulk fluid flow). Convection is usually the dominant form of heat transfer in liquids and gases. Note that this definition of convection is only applicable in Heat transfer and thermodynamic contexts.

Thermal resistance

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.

Thermal conductivity

The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.

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