Lecture

Introduction to Laser Micromachining

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Description

This lecture introduces laser micromachining, covering various applications such as surface hardening, 3D nanoprinting, cutting, and additive manufacturing. It explores laser-matter interaction, the smallest lattice in the world, and the concept of photons. The lecture delves into the characteristics of laser beams, Gaussian beams, and the process of laser micro-machining. It discusses single and multi-photon processes, non-linear absorption, and femtosecond laser applications. The lecture also touches on sub-wavelength patterning, time scales in laser ablation, and 3D machining in glass with femtosecond lasers.

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Related concepts (26)

Laser ablation

Laser ablation or photoablation (also called laser blasting) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave laser beam if the laser intensity is high enough.

Pulsed laser

Pulsed operation of lasers refers to any laser not classified as continuous wave, so that the optical power appears in pulses of some duration at some repetition rate. This encompasses a wide range of technologies addressing a number of different motivations. Some lasers are pulsed simply because they cannot be run in continuous mode. In other cases the application requires the production of pulses having as large an energy as possible.

Gaussian beam

In optics, a Gaussian beam is a beam of electromagnetic radiation with high monochromaticity whose amplitude envelope in the transverse plane is given by a Gaussian function; this also implies a Gaussian intensity (irradiance) profile. This fundamental (or TEM00) transverse Gaussian mode describes the intended output of most (but not all) lasers, as such a beam can be focused into the most concentrated spot. When such a beam is refocused by a lens, the transverse phase dependence is altered; this results in a different Gaussian beam.

Excimer laser

An excimer laser, sometimes more correctly called an exciplex laser, is a form of ultraviolet laser which is commonly used in the production of microelectronic devices, semiconductor based integrated circuits or "chips", eye surgery, and micromachining. Since 1960s excimer lasers are widely used in high-resolution photolithography machines, one of the critical technologies required for microelectronic chip manufacturing. The term excimer is short for 'excited dimer', while exciplex is short for 'excited complex'.

Dye laser

A dye laser is a laser that uses an organic dye as the lasing medium, usually as a liquid solution. Compared to gases and most solid state lasing media, a dye can usually be used for a much wider range of wavelengths, often spanning 50 to 100 nanometers or more. The wide bandwidth makes them particularly suitable for tunable lasers and pulsed lasers. The dye rhodamine 6G, for example, can be tuned from 635 nm (orangish-red) to 560 nm (greenish-yellow), and produce pulses as short as 16 femtoseconds.

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