Heat transferHeat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
Convection (heat transfer)Convection (or convective heat transfer) is the transfer of heat from one place to another due to the movement of fluid. Although often discussed as a distinct method of heat transfer, convective heat transfer involves the combined processes of conduction (heat diffusion) and advection (heat transfer by bulk fluid flow). Convection is usually the dominant form of heat transfer in liquids and gases. Note that this definition of convection is only applicable in Heat transfer and thermodynamic contexts.
Thermal conductionConduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k. Heat spontaneously flows along a temperature gradient (i.e. from a hotter body to a colder body). For example, heat is conducted from the hotplate of an electric stove to the bottom of a saucepan in contact with it.
Heat sinkA heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules.
ConvectionConvection is single or multiphase fluid flow that occurs spontaneously due to the combined effects of material property heterogeneity and body forces on a fluid, most commonly density and gravity (see buoyancy). When the cause of the convection is unspecified, convection due to the effects of thermal expansion and buoyancy can be assumed. Convection may also take place in soft solids or mixtures where particles can flow. Convective flow may be transient (such as when a multiphase mixture of oil and water separates) or steady state (see Convection cell).
Thermal radiationThermal radiation is electromagnetic radiation generated by the thermal motion of particles in matter. Thermal radiation is generated when heat from the movement of charges in the material (electrons and protons in common forms of matter) is converted to electromagnetic radiation. All matter with a temperature greater than absolute zero emits thermal radiation. At room temperature, most of the emission is in the infrared (IR) spectrum. Particle motion results in charge-acceleration or dipole oscillation which produces electromagnetic radiation.
Fluid dynamicsIn physics, physical chemistry and engineering, fluid dynamics is a subdiscipline of fluid mechanics that describes the flow of fluids—liquids and gases. It has several subdisciplines, including aerodynamics (the study of air and other gases in motion) and hydrodynamics (the study of liquids in motion). Fluid dynamics has a wide range of applications, including calculating forces and moments on aircraft, determining the mass flow rate of petroleum through pipelines, predicting weather patterns, understanding nebulae in interstellar space and modelling fission weapon detonation.
Heat transfer coefficientIn thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).
HeatIn thermodynamics, heat is the thermal energy transferred between systems due to a temperature difference. In colloquial use, heat sometimes refers to thermal energy itself. An example of formal vs. informal usage may be obtained from the right-hand photo, in which the metal bar is "conducting heat" from its hot end to its cold end, but if the metal bar is considered a thermodynamic system, then the energy flowing within the metal bar is called internal energy, not heat.
Forced convectionForced convection is a mechanism, or type of transport, in which fluid motion is generated by an external source (like a pump, fan, suction device, etc.). Alongside natural convection, thermal radiation, and thermal conduction it is one of the methods of heat transfer and allows significant amounts of heat energy to be transported very efficiently. This mechanism is found very commonly in everyday life, including central heating, air conditioning, steam turbines, and in many other machines.
Electromagnetic radiationIn physics, electromagnetic radiation (EMR) consists of waves of the electromagnetic (EM) field, which propagate through space and carry momentum and electromagnetic radiant energy. Types of EMR include radio waves, microwaves, infrared, (visible) light, ultraviolet, X-rays, and gamma rays, all of which are part of the electromagnetic spectrum. Classically, electromagnetic radiation consists of electromagnetic waves, which are synchronized oscillations of electric and magnetic fields.
Fluid mechanicsFluid mechanics is the branch of physics concerned with the mechanics of fluids (liquids, gases, and plasmas) and the forces on them. It has applications in a wide range of disciplines, including mechanical, aerospace, civil, chemical, and biomedical engineering, as well as geophysics, oceanography, meteorology, astrophysics, and biology. It can be divided into fluid statics, the study of fluids at rest; and fluid dynamics, the study of the effect of forces on fluid motion.
Thermal management (electronics)All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Relativistic heat conductionRelativistic heat conduction refers to the modelling of heat conduction (and similar diffusion processes) in a way compatible with special relativity. In special (and general) relativity, the usual heat equation for non-relativistic heat conduction must be modified, as it leads to faster-than-light signal propagation. Relativistic heat conduction, therefore, encompasses a set of models for heat propagation in continuous media (solids, fluids, gases) that are consistent with relativistic causality, namely the principle that an effect must be within the light-cone associated to its cause.
Convection cellIn the field of fluid dynamics, a convection cell is the phenomenon that occurs when density differences exist within a body of liquid or gas. These density differences result in rising and/or falling currents, which are the key characteristics of a convection cell. When a volume of fluid is heated, it expands and becomes less dense and thus more buoyant than the surrounding fluid. The colder, denser part of the fluid descends to settle below the warmer, less-dense fluid, and this causes the warmer fluid to rise.
Combined forced and natural convectionIn fluid thermodynamics, combined forced convection and natural convection, or mixed convection, occurs when natural convection and forced convection mechanisms act together to transfer heat. This is also defined as situations where both pressure forces and buoyant forces interact. How much each form of convection contributes to the heat transfer is largely determined by the flow, temperature, geometry, and orientation. The nature of the fluid is also influential, since the Grashof number increases in a fluid as temperature increases, but is maximized at some point for a gas.
Thermal conductivityThe thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or . Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity and are very efficient at conducting heat, while the opposite is true for insulating materials like mineral wool or Styrofoam.
Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Computer fanA computer fan is any fan inside, or attached to, a computer case used for active cooling. Fans are used to draw cooler air into the case from the outside, expel warm air from inside and move air across a heat sink to cool a particular component. Both axial and sometimes centrifugal (blower/squirrel-cage) fans are used in computers. Computer fans commonly come in standard sizes, such as 92 mm, 120 mm (most common), 140 mm, and even 200220 mm. Computer fans are powered and controlled using 3-pin or 4-pin fan connectors.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
