Lecture

Micro-Electro-Mechanical Systems

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In course

MICRO-534: Advanced MEMS & microsystems

In depth analysis of the operation principles and technology of advanced micro- and nanosystems. Familiarisation to their implementation into products and their applications. ...

Description

This lecture introduces Micro-Electro-Mechanical Systems (MEMS), which integrate mechanical elements, sensors, actuators, and sometimes electronics on a common substrate through microfabrication technology. It covers the general operating principles, MEMS elements like actuators and sensors, scaling laws, the choice of silicon for MEMS, sensors for various measurements, and actuators for different applications.

Instructors (2)

Niels Quack

Prof. Dr. Niels Quack received the M.Sc. degree from Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland, in 2005, and the Dr.Sc. degree from Eidgenössische Technische Hochschule Zürich (ETH), Zürich, Switzerland, in 2010. From 2011 to 2015, he was Postdoctoral Researcher and Visiting Scholar with the Integrated Photonics Laboratory, Berkeley Sensor and Actuator Center, University of California, Berkeley, CA, USA. From 2014 to 2015, he was Senior MEMS Engineer with Sercalo Microtechnology, Neuchâtel, Switzerland. He is currently an SNSF Assistant Professor with Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland. He has authored and co-authored more than 50 papers in leading technical journals and conferences. His research interests include photonic micro and nanosystems, with an emphasis on diamond photonics and silicon photonic MEMS. He is Steering Committee Member of the IEEE International Conference on Optical MEMS and Nanophotonics (OMN) and served as General Chair of the IEEE OMN 2018 and the Latsis Symposium 2019 on Diamond Photonics. He is a Senior Member of IEEE, Member of The Optical Society (OSA) and life member of SPIE.

Danick Briand

Expertise MEMS and MicrosystemsFlexible and Printed ElectronicsEnergy Harvesting and PowerMEMSSmart Sensing SystemsAdvanced Gas Sensing TechnologiesMicrofabrication and Printing technologiesMicrosystems Integration and Packaging Expertise MEMS and MicrosystemsFlexible and Printed ElectronicsEnergy Harvesting and PowerMEMSSmart Sensing SystemsAdvanced Gas Sensing TechnologiesMicrofabrication and Printing technologiesMicrosystems Integration and Packaging Mission Environmentally-friendly technology is a rapid

Official source

Related concepts (32)

Poisson's ratio

In materials science and solid mechanics, Poisson's ratio (nu) is a measure of the Poisson effect, the deformation (expansion or contraction) of a material in directions perpendicular to the specific direction of loading. The value of Poisson's ratio is the negative of the ratio of transverse strain to axial strain. For small values of these changes, is the amount of transversal elongation divided by the amount of axial compression. Most materials have Poisson's ratio values ranging between 0.0 and 0.5.

Young's modulus

Young's modulus , the Young modulus, or the modulus of elasticity in tension or axial compression (i.e., negative tension), is a mechanical property that measures the tensile or compressive stiffness of a solid material when the force is applied lengthwise. It quantifies the relationship between tensile/compressive stress (force per unit area) and axial strain (proportional deformation) in the linear elastic region of a material and is determined using the formula: Young's moduli are typically so large that they are expressed not in pascals but in gigapascals (GPa).

Ultimate tensile strength

Ultimate tensile strength (also called UTS, tensile strength, TS, ultimate strength or in notation) is the maximum stress that a material can withstand while being stretched or pulled before breaking. In brittle materials the ultimate tensile strength is close to the yield point, whereas in ductile materials the ultimate tensile strength can be higher. The ultimate tensile strength is usually found by performing a tensile test and recording the engineering stress versus strain.

Elastic modulus

An elastic modulus (also known as modulus of elasticity) is the unit of measurement of an object's or substance's resistance to being deformed elastically (i.e., non-permanently) when a stress is applied to it. The elastic modulus of an object is defined as the slope of its stress–strain curve in the elastic deformation region: A stiffer material will have a higher elastic modulus. An elastic modulus has the form: where stress is the force causing the deformation divided by the area to which the force is applied and strain is the ratio of the change in some parameter caused by the deformation to the original value of the parameter.

Shear modulus

In materials science, shear modulus or modulus of rigidity, denoted by G, or sometimes S or μ, is a measure of the elastic shear stiffness of a material and is defined as the ratio of shear stress to the shear strain: where = shear stress is the force which acts is the area on which the force acts = shear strain. In engineering , elsewhere is the transverse displacement is the initial length of the area. The derived SI unit of shear modulus is the pascal (Pa), although it is usually expressed in gigapascals (GPa) or in thousand pounds per square inch (ksi).

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