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Concept

Circuit diagram

Related publications (27)

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Mikhail Asiatici

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Circuit Design, Architecture and CAD for RRAM-based FPGAs

Xifan Tang

Field Programmable Gate Arrays (FPGAs) have been indispensable components of embedded systems and datacenter infrastructures. However, energy efficiency of FPGAs has become a hard barrier preventing their expansion to more application contexts, due to two ...

EPFL2017

Nanoscale Sensors for Ultrasensitive Label-free Detection of Cancer Biomarkers and Monitoring of Therapeutic Compounds

Ioulia Tzouvadaki

Prostate cancer is a life-threatening malignant disease, one the most common cancer types in men and leading cause of death among men because of cancer. Considering the state of the art for the diagnosis of prostate cancer a man overall has to suffer uncom ...

EPFL2017

Thermal Issues in Deep Sub-Micron FDSOI Circuits

Yusuf Leblebici, Can Baltaci

Self-heating effects became more prominent with the introduction of the modern devices like FDSOI and low thermal conductivity materials such as SiO2. Consequently, the design of high speed digital circuits which are the time-critical blocks of high perfor ...

Ieee2016

Devices, systems and methods for dispensing and analysing particles

Philippe Renaud, Yann Barrandon, David Vincent Bonzon, Jean-Baptiste Bureau

The present invention relates to a pipette tip comprising a thin holed membrane at its distal end, which is designed to be adapted with a system comprising at least an impedance analyser and a fluidic actuator to perform the dispensing and analysis of part ...

2016

Robustness Analysis of Controllable-Polarity Silicon Nanowire Devices and Circuits

Hassan Ghasemzadeh Mohammadi

Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...

EPFL2016

Substrate Current Optimization in Smart Power ICs

Pietro Buccella

Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...

EPFL2016