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Concept

Electromigration

Related publications (14)

IIBLAST: Speeding Up Commercial FPGA Routing by Decoupling and Mitigating the Intra-CLB Bottleneck

Mirjana Stojilovic, Stefan Nikolic, Shashwat Shrivastava

We identified that in modern commercial FPGAs, routing signals from the general interconnect to the configurable logic blocks (CLBs) through a very sparse input interconnect block (IIB) represents a significant runtime bottleneck. This is despite academic ...

IEEE2023

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Benjamin Aaron Helfrecht

As the challenges in continued scaling of the integrated circuit technology escalate every generation, there is an urgent need to find viable solutions for both the front-end-of-line (transistors) and the back-end-of-line (interconnects). For the interconn ...

AMER INST PHYSICS2020

Runaway electron modelling in the self-consistent core European Transport Simulator

Joan Decker

Relativistic runaway electrons are a major concern in tokamaks. Although significant theoretical development had been undertaken in recent decades, we still lack a self-consistent simulator that could simultaneously capture all aspects of this phenomenon. ...

IOP Publishing Ltd2019

Three-Dimensional Integrated Ultra-Low-Volume Passive Microfluidics with Ion-Sensitive Field-Effect Transistors for Multiparameter Wearable Sweat Analyzers

Mihai Adrian Ionescu, Francesco Bellando, Hoël Maxime Guérin, Fabien Patrick Wildhaber, Erick Antonio Garcia Cordero, Junrui Zhang, Johan Frédéric Longo

Wearable systems could offer noninvasive and real-time solutions for monitoring of biomarkers in human sweat as an alternative to blood testing. Recent studies have demonstrated that the concentration of certain biomarkers in sweat can be directly correlat ...

2018

Ultra-Low Power Ion-Sensing Smart Platform for Noninvasive Healthcare Applications

Mihai Adrian Ionescu, Francesco Bellando, Hoël Maxime Guérin, Erick Antonio Garcia Cordero

The development of nanotechnologies, and the advent of micro/nano-sensors with novel functionalities integrated on flexible substrates, has opened the way to the development of wearable technology. Interest in wearable technology comes from the considerabl ...

2016

Stretchable electronic structures formed of thin films integrated with soft heterogeneous substrate

Stéphanie Lacour, Hugues Vandeparre

Stretchable electronic structure comprising one intrinsically fragile thin film integrated on or within a soft heterogeneous substrate. The invention also relates to a process for manufacturing such a structure. ...

2015

Design of Digital SoC for Operation at High Temperatures

Radisav Cojbasic

There is a growing demand for Systems-on-Chip, integrating microprocessors, on-chip memories, data converters and a variety of sensors, which are capable of reliable operation at high temperatures. For instance, modern aircraft industry demands microcontro ...

EPFL2014

On performance scaling and speed of junctionless transistors

Jean-Michel Sallese, Adil Koukab

A prospective study of the junctionless transistors (JLTs) scaling performances based both on TCAD and analytical evaluations of the intrinsic delay after considering on/off voltage constraints is proposed. The tradeoffs between speed and switching power p ...

Pergamon-Elsevier Science Ltd2013

An implantable biosensor array for personalized therapy applications

Andrea Cavallini

At present, most of the tests involved in personalized medicine are complex and must be conducted in specialized centers. The development of appropriate, fast and inexpensive diagnostic technologies can encourage medical personnel in performing preventive ...

EPFL2013

A Fast TCAD-based Methodology for Variation Analysis of Emerging Nano-Devices

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Majid Yazdani, Hassan Ghasemzadeh Mohammadi

Variability analysis of nanoscale transistors and circuits is emerging as a necessity at advanced technology nodes. Technology Computer Aided Design (TCAD) tools are powerful ways to get an accurate insight of Process Variations (PV). However ...

2013

FireBird: PowerPC e200 Based SoC for High Temperature Operation

Yusuf Leblebici, Andreas Peter Burg, Thomas Maeder, Pascal Andreas Meinerzhagen, Conor Joseph Slater, Carl Christian Sten Dominic Senning, Ömer Cogal, Radisav Cojbasic

PowerPC Architecture microcontrollers are commonly used in embedded applications. In this work we present FireBird, the first PowerPC based SoC for reliable operation beyond 200C. It is a significant challenge to design SoCs for reliable operation at high ...

2013

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

Yusuf Leblebici, John Richard Thome, Michail Zervas, Yassir Madhour

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Physical Design Issues in 3-D Integrated Technologies

Vasileios Pavlidis

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...

Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010

Synthesis of Networks on Chips for 3D Systems on Chips

Giovanni De Micheli, Luca Benini, Srinivasan Murali, Ciprian Seiculescu

Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (NoCs) are necessary to efficiently handle the 3D interconnect complexity. Desi ...

2009