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Concept

Zen 2

Related publications (4)

System-Level Exploration of In-Package Wireless Communication for Multi-Chiplet Platforms

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Joshua Alexander Harrison Klein, Rafael Medina Morillas

Multi-Chiplet architectures are being increasingly adopted to support the design of very large systems in a single package, facilitating the integration of heterogeneous components and improving manufacturing yield. However, chiplet-based solutions have to ...

2023

RPCValet: NI-Driven Tail-Aware Balancing of µs-Scale RPCs

Babak Falsafi, Alexandros Daglis, Mark Johnathon Sutherland

Modern online services come with stringent quality requirements in terms of response time tail latency. Because of their decomposition into fine-grained communicating software layers, a single user request fans out into a plethora of short, μs-scale RPCs, ...

ACM2019

Shared Frontend for Manycore Server Processors

Ilknur Cansu Kaynak

Instruction-supplymechanisms, namely the branch predictors and instruction prefetchers, exploit recurring control flow in an application to predict the applicationâ s future control flow and provide the core with a useful instruction stream to execute in ...

EPFL2015

Thermal Characterization of Cloud Workloads on a Power-Efficient Server-on-Chip

Babak Falsafi, Dorde Jevdic, Pejman Lotfi Kamran

We propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and f ...

2012