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Concept

Dual in-line package

Related publications (25)

Remotely Powered Wireless Cortical Implants for Brain-Machine Interfaces

Kanber Mithat Silay

Brain-machine interfaces hold promise for restoring basic functions such as movement or speech for severely disabled patients, as well as for controlling neuroprosthetic devices for amputees. One of the major challenges of clinically viable neuroprostheses ...

EPFL2012

Physical Design Issues in 3-D Integrated Technologies

Vasileios Pavlidis

Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for 2-D circuits are not sufficient to manage the added complexity caused by the third dime ...

Springer-Verlag New York, Ms Ingrid Cunningham, 175 Fifth Ave, New York, Ny 10010 Usa2010

Generic DSP-based Implantable Body Sensor Node

Léandre Bolomey

To improve health, to help to manage chronical disease and to provide equal access to healthcare, continuous monitoring of physiological parameter associated to telemedicine is mandatory. In this perspective Body Sensor Networks concept has emerged. It inc ...

EPFL2010

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

The quantity of MEMS manufacturers has considerably been increasing these last years. This doesn't mean that the introduction of such products on the market has become easier. A packaging operation is needed to obtain a usable product out of a microsystem. ...

EPFL2009

Hermetic package for optical MEMS

Thomas Maeder, Peter Ryser, Jacques Jacot, Yannick Sébastien Fournier

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009