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Related publications (25)

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Integrated Wireless Power, Data Communication, and Thermal Sensing System for Autonomous Multisite Brain Implants

Mohammad Javad Karimi

Implanted medical devices (IMDs) have been widely developed to support the monitoring and recording of biological data inside the body or brain. Wirelessly powered IMDs, a subset of implantable electronics, have been proposed to eliminate the limitations r ...

EPFL2024

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Control of intermetallics in the interface in directed energy deposition of titanium on stainless steel 316L

Di Cui

Application of a single metal or alloy is often restricted by its properties from optimal combination of performance and cost. Therefore, there is a vast need of joining dissimilar metals for various applications in biomedical, aerospace, automobile and ma ...

EPFL2023

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

David Atienza Alonso, Giovanni Ansaloni, Marina Zapater Sancho, Yasir Mahmood Qureshi, Joshua Alexander Harrison Klein, Rafael Medina Morillas

In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

IEEE2022

Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test

Yi Zhang, Rui Wu

The latest standard "New Dual" power module has been developed for both silicon and silicon-carbide devices to meet the increasing demands in high reliability and high temperature power electronic applications. Due to the new package is just starting to re ...

PERGAMON-ELSEVIER SCIENCE LTD2022

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Benjamin Aaron Helfrecht

As the challenges in continued scaling of the integrated circuit technology escalate every generation, there is an urgent need to find viable solutions for both the front-end-of-line (transistors) and the back-end-of-line (interconnects). For the interconn ...

AMER INST PHYSICS2020

Two-Element Antenna-Active Phase Shifter Packaging at 77 GHz

Anja Skrivervik, Mirmehdi Seyyedesfahlan

This work presents a low cost and wire-bonded active phase shifter chip to RF circuitry on PCB board packaging for implementing a two-element phased array antenna at 77 GHz. The 1.5 mm × 1.1 mm chip is embedded in RO3003 PCB board and its GSG ports are wir ...

IEEE2019

Transient Current Technique characterization of bonded interfaces for monolithic silicon radiation detectors

Jacopo Bronuzzi

This thesis aims at demonstrating a novel technique for the characterization of interfaces obtained by a CMOS-compatible Surface Activated Bonding (SAB) process between silicon wafers. This enables the optimization of the two main components of monolithic ...

EPFL2018

Physical Design Considerations of One-level RRAM-based Routing Multiplexers

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Xifan Tang, Edouard Giacomin

Resistive Random Access Memory (RRAM) technology opens the opportunity for granting both high-performance and low- power features to routing multiplexers. In this paper, we study the physical design considerations related to RRAM- based routing mult ...

ACM2017

Copper TSV-Based Die-Level Via-Last 3D Integration Process with Parylene-C Adhesive Bonding Technique

Yusuf Leblebici, Seniz Esra Küçük

This paper presents a die-level post-CMOS processing protocol for multi-layer homogeneous 3D integration with adhesive bonding technique using parylene-C as an intermediate bonding layer and sidewall passivation material. This protocol was used to fabricat ...

2016

Deformation behavior of nanoporous polycrystalline silver layers sintered by low temperature bonding: experiment and simulation

Saba Zabihzadeh

Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...

EPFL2016

Method for speeding up boolean satisfiability

Giovanni De Micheli, Luca Gaetano Amarù, Pierre-Emmanuel Julien Marc Gaillardon

A method for transforming a tautology check of an original logic circuit into a contradiction check of the original logic circuit and vice versa comprises interpreting the original logic circuit in terms of AND, OR, MAJ, MIN, XOR, XNOR, INV original logic ...

2016

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Thomas Maeder, Peter Ryser, Caroline Marguerite Jacq

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Growth of intermetallic compounds in the Au-In system: Experimental study and 1-D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon

The gold indium system is of primary interest for bonding processes such as solid liquid interdiffusion bonding. In order to optimize the manufacturing parameters, it is essential to know which intermetallic compounds (IMCs) are formed when solid Au and li ...

Elsevier2014

Reliability Aspects of Microelectromechanical Systems for Space Applications : Mechanical Properties of Structural Materials and Analysis of Packaging Strains

Tobias Bandi

Microelectromechanical systems (MEMS) are an essential ingredient in many technological innovations and a source of game-changing inventions in the automotive industry, space exploration, consumer electronics and medical applications due to its capability ...

EPFL2014

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

3D-Integration of a Carbon Nanotube based RF-NEMS

Rokhaya Gueye

In the framework of the NanoTera project CabTuRes, a system-in-package for a nano-resonator was proposed, integrating CMOS driving electronics and vacuum encapsulation. This doctoral research aimed to investigate 3D-integration technologies for a Single-Wa ...

EPFL2013

Opportunities for high-pressure microfluidics in biomedical applications

Ata Tuna Ciftlik

Pressure lies at the basis of operation of most microfluidic systems, and is a determinant factor in the extent of miniaturization and in limiting the throughput and time constant of the microfluidic assays. Despite the apparent importance given to fluidic ...

EPFL2013

A miniaturised autonomous sensor based on nanowire materials platform: the SiNAPS mote

Maher Kayal, Naser Khosro Pour

A micro-power energy harvesting system based on core(crystalline Si)-shell(amorphous Si) nanowire solar cells together with a nanowire-modified CMOS sensing platform have been developed to be used in a dust-sized autonomous chemical sensor node. The mote ( ...

Spie-Int Soc Optical Engineering2013