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Concept

Integrated passive devices

Related publications (27)

Organic Thin Film Transistors on Flexible Polyimide Substrates Fabricated by Full Wafer Stencil Lithography

Mihai Adrian Ionescu, Jürgen Brugger, Andreea Veronica Savu, Katrin Sidler Arnet, Nenad Cvetkovic

This paper presents new results on miniaturized organic thin film transistors (TFT) fabricated on a spin coated polyimide (PI) film. Patterning steps, that are vital for the integrity and electrical performances of the organic TFT, were performed using res ...

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2009

Photoluminescence from a single InGaAs epitaxial quantum rod

Microphotoluminescence (mu-PL) experiment has been performed on a structure with InGaAs/GaAs epitaxial quantum rods (quantum dots with the aspect ratio as high as 4.1) grown by depositing short-period InAs/GaAs superlattice by molecular beam epitaxy on GaA ...

AIP American Institute of Physics2008

Full-wafer fabrication by nanostencil lithography of micro/nanomechanical mass sensors monolithically integrated with CMOS

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 μm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ...

2008

Controlling the aspect ratio of quantum dots: From columnar dots to quantum dots

Marco Rossetti

We demonstrate the feasibility and flexibility of artificial shape engineering of epitaxial semiconductor nanostructures. Novel nanostructures including InGaAs quantum rods (QRs), nanocandles, and quantum dots (QDs)-in-rods were realized on a GaAs substrat ...

2008

Shape-engineered epitaxial InGaAs quantum rods for laser applications

We apply artificial shape engineering of epitaxial semiconductor nanostructures to demonstrate InGaAs quantum rods (QRs), nanocandles, and quantum dots-in-rods on a GaAs substrate. The evolution of the QRs from a zero-dimensional to one-dimensional confine ...

AIP American Institute of Physics2008

Copper / low-k technological platform for the fabrication of high quality factor above-IC passive devices

Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...

EPFL2007

Low firing temperature thick-film piezoresistive composites : properties and conduction mechanism

Sonia Vionnet Menot

Thick-film technology has found applications on miniaturised hybrid circuits in various fields (automotive electronics, televisions, ...). This technology is also now widely used for the fabrication of force and pressure sensors that use the piezoresistive ...

EPFL2005