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Concept

Moore's second law

Related publications (10)

Fabrication of Single-Crystalline InSb-on-Insulator by Rapid Melt Growth

Anna Fontcuberta i Morral, Nicholas Paul Morgan

InSb has the smallest bandgap and highest electron mobility among III-V semiconductors and is widely used for photodetectors and high-frequency electronic applications. Integration of InSb directly on Si would drastically reduce the fabrication cost and en ...

Wiley2021

An integrated design tool for timber plate structures to generate joints geometry, fabrication toolpath, and robot trajectories

Yves Weinand, Nicolas Henry Pierre Louis Rogeau

This paper presents an integrated design tool for structures composed of engineered timber panels that are connected by traditional wood joints. Recent advances in computational architecture have permitted to automate the fabrication and assembly of such s ...

2021

Doping challenges and pathways to industrial scalability of III–V nanowire arrays

Anna Fontcuberta i Morral, Wonjong Kim, Lucas Güniat, Valerio Piazza

Semiconductor nanowires (NWs) have been investigated for decades, but their application into commercial products is still difficult to achieve, with triggering causes related to the fabrication cost and structure complexity. Dopant control at the nanoscale ...

2021

Advantages of patient-specific cutting guides with disposable instrumentation in total knee arthroplasty: a case control study

Brigitte Jolles-Haeberli

BackgroundTotal knee arthroplasty (TKA) is most frequently planned using conventional two-dimensional weight-bearing lower limb radiographs and is performed with conventional femoral and tibial cutting guides. Questions have been raised about the accuracy ...

BMC2021

Trading off Energy versus Accuracy in Modern Computing Systems : From Digital Circuit Design to Programming Techniques

Jérémy Lucien Maurice Schlachter

The slowdown of Moore's law, which has been the driving force of the electronics industry over the last 5 decades, is causing serious problem to Integrated Circuits (ICs) improvements. Technology scaling is becoming more and more complex and fabrication co ...

EPFL2018

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Giovanni De Micheli, Luca Benini

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and l ...

Institute of Electrical and Electronics Engineers2015

Fabrication of structured anode-supported solid oxide fuel cell by powder injection molding

Jan Van Herle, Antonin Faes, Zacharie Wuillemin

Powder Injection Molding (PIM) gives the possibility to produce, at an industrial rate, ceramic parts with fine details. It is thus a possible approach to reduce the fabrication costs of Solid Oxide Fuel Cells (SOFCs). This work presents fabrication and el ...

2013

A High-throughput and Low-Latency Interconnection Network for Multi-Core Clusters with 3-D Stacked L2 Tightly-Coupled Data Memory

Giovanni De Micheli, Luca Benini

The performance of most digital systems today is limited by the interconnect latency between logic and memory, rather than by the performance of logic or memory itself. Three- dimensional (3-D) integration using through-silicon-vias (TSVs) may provide a so ...

2012

Decoding Nanowire Arrays Fabricated with the Multi-Spacer Patterning Technique

Giovanni De Micheli, Yusuf Leblebici, Mohamed Haykel Ben Jamaa

Silicon nanowires are a promising solution to address the increasing challenges of fabrication and design at the future nodes of the Complementary Metal-Oxide-Semiconductor (CMOS) Technology roadmap. Despite the attractive opportunity that offers their org ...

IEEE Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, NJ 08855-1331 Usa2009

2PFC™ Image Sensors: Better Image Quality at Lower Cost

A modification to the standard Bayer CFA and photodiode structure for CMOS image sensors is proposed, which we call 2PFC™, meaning “Two Pixel, Full Color”. The blue and red filters of the Bayer pattern are replaced by magenta filters. Under each magenta fi ...

2009