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Related publications (23)

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Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

An analysis of destination choice for opaque airline products using multidimensional binary logit models

Michel Bierlaire

We investigate how customers respond to an opaque airline product offered by a European carrier. In this opaque product design, customers are randomly assigned to travel to one of approximately ten destinations; however, for a fee they may exclude one or m ...

Pergamon-Elsevier Science Ltd2012

Sensors and packages based on LTCC and thick-film technology for severe conditions

Thomas Maeder, Peter Ryser, Caroline Marguerite Jacq

Reliable operation in harsh environments such as high temperatures, high pressures, aggressive media and space, poses special requirements for sensors and packages, which usually cannot be met using polymer-based technologies. Ceramic technologies, especia ...

2009