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Concept

Floorplan (microelectronics)

Related publications (9)

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Yusuf Leblebici, Seniz Esra Küçük

In this paper, a die-level CMOS post-processing scheme for 3D integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The ...

Ieee2016

Substrate Current Optimization in Smart Power ICs

Pietro Buccella

Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...

EPFL2016

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

Yusuf Leblebici, Carlotta Guiducci, Yüksel Temiz

This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Ieee-Inst Electrical Electronics Engineers Inc2013

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Yusuf Leblebici, Carlotta Guiducci, Michail Zervas, Yüksel Temiz

In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-lev ...

IEEE2012

3D Thermal-Aware Floorplanner for Many-Core Single-Chip Systems

David Atienza Alonso, José Luis Ayala Rodrigo

Heat removal and power density distribution delivery have become two major reliability concerns in 3D stacked technology. In this paper, we propose a thermal-driven 3D floorplanner. Our contributions include: (1) a novel multi-objective formulation to cons ...

IEEE Press2011

On-chip implementation of multiprocessor networks and switch fabrics

Giovanni De Micheli

On-chip implementation of multiprocessor systems needs to planarise the interconnect networks onto the silicon floorplan. Compared with traditional ASIC/SoC architectures, Multiprocessor Systems on Chips (MPSoC) node processors are homogeneous, and MPSoC n ...

2008

NoC Design and Implementation in 65 nm Technology

Giovanni De Micheli, David Atienza Alonso, Luca Benini, Srinivasan Murali, Federico Angiolini

As embedded computing evolves towards ever more powerful architectures, the challenge of properly interconnecting large numbers of on-chip computation blocks is becoming prominent. Networks-on-Chip (NoCs) have been proposed as a scalable solution to both p ...

2007

Application of FPGA Emulation to SoC Floorplan and Packaging Exploration

Giovanni De Micheli, David Atienza Alonso, Luca Benini, Pablo Garcia del Valle

New tendencies in the consumer electronics market present Multi-Processor Systems-On-Chip (MPSoCs) as a promising solution for meeting the processing demands of upcoming generations of user applications. MPSoCs are complex to design, as they must execute m ...

2007

Improving instruction cache performance in OLTP

Anastasia Ailamaki

Instruction-cache misses account for up to 40%; of execution time in online transaction processing (OLTP) database workloads. In contrast to data cache misses, instruction misses cannot be overlapped with out-of-order execution. Chip design limitations do ...

Association for Computing Machinery2006